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Nanometer CMOS ICS: From Basics to Asics

Harry J. M. Veendrick

  • Bindwijze: Hardcover
  • Taal: en
  • ISBN: 9783319475950
From Basics to ASICs
Inhoud
Taal:en
Bindwijze:Hardcover
Oorspronkelijke releasedatum:08 mei 2017
Aantal pagina's:611
Illustraties:Nee
Betrokkenen
Hoofdauteur:Harry J. M. Veendrick
Tweede Auteur:Harry J. M. Veendrick
Tweede Auteur:Harry J. M. Veendrick
Overige kenmerken
Editie:2
Extra groot lettertype:Nee
Product breedte:178 mm
Product lengte:254 mm
Studieboek:Ja
Verpakking breedte:183 mm
Verpakking hoogte:42 mm
Verpakking lengte:263 mm
Verpakkingsgewicht:1683 g
Overige kenmerken
Editie:2
Extra groot lettertype:Nee
Product breedte:178 mm
Product lengte:254 mm
Studieboek:Ja
Verpakking breedte:183 mm
Verpakking hoogte:42 mm
Verpakking lengte:263 mm
Verpakkingsgewicht:1683 g

Samenvatting

Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks.

This textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits. It includes aspects of scaling to even beyond 12nm CMOS technologies and designs. It clearly describes the fundamental CMOS operating principles and presents substantial insight into the various aspects of design implementation and application. Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks. The text is based upon in-house Philips, NXP Semiconductors, Applied Materials, ASML, IMEC, ST-Ericsson, TSMC, etc., courseware, which, to date, has been completed by more than 4500 engineers working in a large variety of related disciplines: architecture, design, test, fabrication process, packaging, failure analysis and software.